Micromachining of pure silicon by molecular dynamics

The cutting of nanometer parts has been simulated using molecular dynamics. In this paper single crystals of silicon were cut by idealized tools. The results are compared with those of metals. Pure single crystals of silicon having faces of (111), (1̄1̄1̄), (11̄0), (1̄10), (1̄1̄2), and (112̄) were c...

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Bibliographic Details
Published in:Thin solid films 1998-12, Vol.334 (1-2), p.221-224
Main Authors: Nozaki, Tadatoshi, Doyama, Masao, Kogure, Yoshiaki, Yokotsuka, Tatsuo
Format: Article
Language:English
Subjects:
Computer simulation
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Mechanical and acoustical properties of condensed matter
Mechanical properties of solids
Micro-tribology
Molecular dynamics
Physics
Silicon
Surface treatments
Tribology and hardness
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Summary:The cutting of nanometer parts has been simulated using molecular dynamics. In this paper single crystals of silicon were cut by idealized tools. The results are compared with those of metals. Pure single crystals of silicon having faces of (111), (1̄1̄1̄), (11̄0), (1̄10), (1̄1̄2), and (112̄) were cut by a sharp edge. The potential used here was a three-body Stillinger–Weber potential. The depth of the edge was chosen to be one, two and three (111) atomic layers. Single crystals of silicon were found to be harder than those of metals. The plastic deformation in silicon was more restricted in a limited area than in metals. The surface was smoother when the cutting thickness was thicker. Atomic shuffling was not observed. The creation of dislocations depends on the cutting speed. The chip was always found to be amorphous.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(98)01148-1