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Microstructural evidence for diffusional creep in copper using atomic force microscopy

Steady state creep rates for Oxygen Free High Conductivity (OFHC) copper[Copper No 101], at 0.5-0.6T sub m , stresses up to 4.4 MPa and a grain size of approx55 mu m, in terms of stress dependence, temperature dependence and magnitude show reasonable agreement with Coble creep theory. Substantial sc...

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Bibliographic Details
Published in:Scripta materialia 2001-02, Vol.44 (2), p.351-357
Main Authors: McNee, K.R, Greenwood, G.W, Jones, H
Format: Article
Language:English
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Summary:Steady state creep rates for Oxygen Free High Conductivity (OFHC) copper[Copper No 101], at 0.5-0.6T sub m , stresses up to 4.4 MPa and a grain size of approx55 mu m, in terms of stress dependence, temperature dependence and magnitude show reasonable agreement with Coble creep theory. Substantial scratch displacements at grain boundaries have been shown in the present work resulting from this low stress deformation of OFHC copper. On the basis of these scratch displacements the deformation mechanism can, with some certainty, be attributed to either diffusional creep or possibly grain boundary sliding accommodated by slip. In addition to the scratch displacements, enlarged grain boundary grooves have been seen on grain boundaries predominantly transverse to the applied stress using optical microscopy and scanning electron microscopy and profiled using atomic force microscopy. It is difficult to account for the formation of these under any mechanism other than diffusion creep. Atomic Force Microscopy has produced clear evidence of deposition of material at grain boundaries predominantly transverse to the applied stress and depletion of material at grain boundaries predominantly parallel to the applied stress. These features can only be attributed to the operation of a diffusion flow mechanism.
ISSN:1359-6462
1872-8456
DOI:10.1016/S1359-6462(00)00570-4