VLSI design in the 3rd dimension

Recently, the need for increased circuit complexity has outpaced our ability to perform efficient routing and placement, while still maintaining small die sizes. Part of this problem can be attributed to the limits imposed by designing in two dimensions. Three-dimensional VLSI circuits, obtainable t...

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Bibliographic Details
Published in:Integration (Amsterdam) 1998-09, Vol.25 (1), p.1-16
Main Authors: Strickland, Stephen, Ergin, Erhan, Kaeli, David R., Zavracky, Paul
Format: Article
Language:English
Subjects:
3-D microelectronics
Applied sciences
Commercial tools
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Layout and routing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
VLSI CAD
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Summary:Recently, the need for increased circuit complexity has outpaced our ability to perform efficient routing and placement, while still maintaining small die sizes. Part of this problem can be attributed to the limits imposed by designing in two dimensions. Three-dimensional VLSI circuits, obtainable through using a transferred thin-film process, can provide a path for realizing complete structures, while reducing route lengths and die sizes. In this paper we report on our new three-dimensional design technology, devices which we have fabricated, and our move to an automated 3-D design path using Cadence and Synopsys design tools. We present both discussion of functional 3-D devices, and on-going work on VLSI design tools and the implementation of a 3-D microprocessor.
ISSN:0167-9260
1872-7522
DOI:10.1016/S0167-9260(98)00006-6