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Crack growth across colony boundaries in binary lamellar TiAl

The crack growth across a boundary between two colonies, i.e. regions of differing lamellar orientation, in two-phase lamellar Ti–Al is studied computationally to quantify the influence of such boundaries on toughening, as observed in recent in-situ fracture studies. The model represents the lamella...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2002-06, Vol.329, p.532-537
Main Authors: Arata, J.J.M., Kumar, K.S., Curtin, W.A., Needleman, A.
Format: Article
Language:English
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Summary:The crack growth across a boundary between two colonies, i.e. regions of differing lamellar orientation, in two-phase lamellar Ti–Al is studied computationally to quantify the influence of such boundaries on toughening, as observed in recent in-situ fracture studies. The model represents the lamellar Ti–Al as γ-phase lamellae, modeled as bulk elastic-viscoplastic material, interspersed with α 2-phase lamellae for which either the α 2 phase or α 2–γ interface are considered as weak planes for fracture. Computationally, dynamic plane-strain analyses of the crack propagation are carried out. Fracture in both phases is accommodated using a cohesive surface formulation that permits crack growth and nucleation to evolve naturally. Results show that the lamellar misorientation across a boundary, the thickness of the boundary region, and the spatial offset between successive weak lamellae, all play a role in inhibiting crack propagation across the boundary. The γ phase plasticity has a comparatively small influence on the toughening. The enhancements in applied stress intensities required to nucleate cracks across the colony boundary are comparable to those observed experimentally when the weak-plane spacing is comparable to the spacing of microcracks and crack plane offsets observed experimentally.
ISSN:0921-5093
1873-4936
DOI:10.1016/S0921-5093(01)01504-0