Electroplating of copper films on steel substrates from acidic gluconate baths

Electroplating of thin films of copper onto steel substrate from acidic gluconate bath has been investigated under different conditions of bath composition, pH, current density, and temperature. A detailed study has been made about the effect of these parameters on potentiodynamic cathodic polarizat...

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Bibliographic Details
Published in:Applied surface science 2000-10, Vol.165 (4), p.249-254
Main Authors: Abd El Rehim, S.S, Sayyah, S.M, El Deeb, M.M
Format: Article
Language:English
Subjects:
Acidic guconate baths
Applied sciences
Cross-disciplinary physics: materials science
rheology
Electrodeposition, electroplating
Electroplating of copper films
Exact sciences and technology
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Physics
Steel substrates
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Summary:Electroplating of thin films of copper onto steel substrate from acidic gluconate bath has been investigated under different conditions of bath composition, pH, current density, and temperature. A detailed study has been made about the effect of these parameters on potentiodynamic cathodic polarization, cathodic current efficiency (CCE%), and throwing power (TP) of the bath. Fine grained, highly adherent and smooth bright deposits were produced. X-ray diffraction analysis showed that these deposits were produced in one phase with crystalline cubic structure. The optimum conditions are: 10 g l −1 CuSO 4·5H 2O, 30 g l −1 C 6H 11O 7Na, 10 g l −1 K 2SO 4, pH=2.2, I=2.8 mA cm −2, and temperature range between 22°C and 31°C. The TP of the bath is greatly improved by increasing the current density.
ISSN:0169-4332
1873-5584
DOI:10.1016/S0169-4332(00)00015-5