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Scalable manufacturing of high-index atomic layer–polymer hybrid metasurfaces for metaphotonics in the visible

Metalenses are attractive alternatives to conventional bulky refractive lenses owing to their superior light-modulating performance and sub-micrometre-scale thicknesses; however, limitations in existing fabrication techniques, including high cost, low throughput and small patterning area, have hinde...

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Bibliographic Details
Published in:Nature materials 2023-04, Vol.22 (4), p.474-481
Main Authors: Kim, Joohoon, Seong, Junhwa, Kim, Wonjoong, Lee, Gun-Yeal, Kim, Seokwoo, Kim, Hongyoon, Moon, Seong-Won, Oh, Dong Kyo, Yang, Younghwan, Park, Jeonghoon, Jang, Jaehyuck, Kim, Yeseul, Jeong, Minsu, Park, Chanwoong, Choi, Hojung, Jeon, Gyoseon, Lee, Kyung-il, Yoon, Dong Hyun, Park, Namkyoo, Lee, Byoungho, Lee, Heon, Rho, Junsuk
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Language:English
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Summary:Metalenses are attractive alternatives to conventional bulky refractive lenses owing to their superior light-modulating performance and sub-micrometre-scale thicknesses; however, limitations in existing fabrication techniques, including high cost, low throughput and small patterning area, have hindered their mass production. Here we demonstrate low-cost and high-throughput mass production of large-aperture visible metalenses using deep-ultraviolet argon fluoride immersion lithography and wafer-scale nanoimprint lithography. Once a 12″ master stamp is imprinted, hundreds of centimetre-scale metalenses can be fabricated using a thinly coated high-index film to enhance light confinement, resulting in a substantial increase in conversion efficiency. As a proof of concept, an ultrathin virtual reality device created with the printed metalens demonstrates its potential towards the scalable manufacturing of metaphotonic devices. The authors propose a method for the scalable manufacturing of metalenses using deep-ultraviolet argon fluoride immersion lithography and wafer-scale nanoimprint lithography, opening a route towards their low-cost, high-throughput mass production.
ISSN:1476-1122
1476-4660
DOI:10.1038/s41563-023-01485-5