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A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology
We present the design, fabrication, and testing of a push-pull differential resonant accelerometer with double-ended-tuning-fork (DETF) as the inertial force sensor. The accelerometer is fabricated with the silicon-on-insulator microelectromechanical systems (MEMS) technology that bridges surface mi...
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Published in: | IEEE sensors journal 2005-12, Vol.5 (6), p.1214-1223 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We present the design, fabrication, and testing of a push-pull differential resonant accelerometer with double-ended-tuning-fork (DETF) as the inertial force sensor. The accelerometer is fabricated with the silicon-on-insulator microelectromechanical systems (MEMS) technology that bridges surface micromachining and bulk micromachining by integrating the 50-/spl mu/m-thick high-aspect ratio MEMS structure with the standard circuit foundry process. Two DETF resonators serve as the force sensor measuring the acceleration through a frequency shift caused by the inertial force acting as axial loading. Two-stage microleverage mechanisms with an amplification factor of 80 are designed for force amplification to increase the overall sensitivity to 160 Hz/g, which is confirmed by the experimental value of 158 Hz/g. Trans-resistance amplifiers are designed and integrated on the same chip for output signal amplification and processing. The 50-/spl mu/m thickness of the high-aspect ratio MEMS structure has no effect on the amplification factor of the mechanism but contributes to a greater capacitance force; therefore, the resonator can be actuated by a much lower ac voltage comparing to the 2-/spl mu/m-thick DETF resonators. The testing results agree with the designed sensitivity for static acceleration. |
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ISSN: | 1530-437X 1558-1748 |
DOI: | 10.1109/JSEN.2005.857876 |