Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials

As a concept to achieve low-cost, high-throughput flip chip on board (FCOB) assembly, a new process has been developed implementing next generation flip chip processing based no-flow fluxing underfill materials. The low-cost, high throughput flip chip process implements large area underfill printing...

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2001-04, Vol.24 (2), p.123-135
Main Authors: Thorpe, R., Baldwin, D.F., Smith, B., McGovern, L.
Format: Article
Language:English
Subjects:
Assembly
Atmosphere
Chips
Costs
Cures
Defects
Flip chip
Furnaces
Materials testing
Mathematical models
Placement
Printing
Soldering
Solders
Studies
Test vehicles
Throughput
Vehicles
Weight control
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Summary:As a concept to achieve low-cost, high-throughput flip chip on board (FCOB) assembly, a new process has been developed implementing next generation flip chip processing based no-flow fluxing underfill materials. The low-cost, high throughput flip chip process implements large area underfill printing, integrated chip placement and underfill flow and simultaneous solder interconnect reflow and underfill cure. The goals of this study are to demonstrate feasibility of no flow underfill materials and the high throughput flip chip process over a range of flip chip configurations, identify the critical process variables affecting yield, analyze the yield of the high throughput flip chip process, and determine the impact of no-flow underfill materials on key process elements. Reported in this work is the assembly of a series of test vehicles to assess process yield and process defects. The test vehicles are assembled by depositing a controlled mass of underfill material on the chip site, aligning chip to the substrate pads, and placing the chip inducing a compression type underfill flow. The assemblies are reflowed in a commercial reflow furnace in an air atmosphere to simultaneously form the solder interconnects and cure the underfill. A series of designed experiments identify the critical process variables including underfill mass, reflow profile, placement velocity, placement force, and underfill material system. Of particular interest is the fact that the no-flow underfill materials studied exhibit an affinity for unique reflow profiles to minimize process defects.
ISSN:1521-334X
1558-0822
DOI:10.1109/6104.930963