Fabrication of MXene based sandwich-like films for excellent flexibility, electromagnetic interference shielding and thermal management

• Published in: Composites. Part A, Applied science and manufacturing Applied science and manufacturing, 2023-10, Vol.173, p.107672, Article 107672
• Main Authors: Ran, Linxin, Qiu, Lijuan, Zhao, Hong, Sun, Furong, Chen, Zhiyi, Zhao, Lijuan, Yi, Longfei, Ji, Xiaoying
• Format: Article
• Language: English
• Subjects: A. Layered structures; A. Polymer-matrix composites (PMCs); absorption; anisotropy; B. Thermal properties; electric potential difference; electromagnetic interference; electronics; EMI shielding; heat transfer; thermal conductivity
• ISSN: 1359-835X; 1878-5840
• DOI: 10.1016/j.compositesa.2023.107672

This work has disclosed a series of sandwich like films with combined superior EMI shielding, anisotropic thermal transport, Joule heating and flexibility. [Display omitted] •Fabricating sandwich structured films based on MXene and Co/C particle.•Successful construction of continuous electrical/thermal conductive channel.•Combined EMI shielding efficiency (42 dB) and absorption capacity (95%).•Anisotropic thermal conduction and excellent electro-thermal conversion.•Mechanically strong and flexible that can be bended, folded and shaped. The booming of modern communication and wearable electronics has greatly necessitated the development of films that could feature both electromagnetic interference shielding and thermal management capacity. Here we report a series of sandwich structured films prepared through freeze drying-laying-hot compression technology. Owing to the unique sandwich like structure, the resulting film has displayed not only EMI shielding performance (42 dB), but also enhanced absorption capacity (95 %). Meanwhile, strong anisotropic thermal conductive property that allows for satisfying in-plane thermal conductivity of 3.29 W m−1 K−1 was achieved. Benefiting from this, excellent electro-thermal conversion capacity that could enable fast de-icing under low voltage (4 V) was also acquired. Furthermore, those sandwich structured films possess sufficient flexibility to sustain repetitive bending, folding and shaping. Herein, this research has expanded the horizons in seeking both superior EMI shielding and heat dissipation capacity, which will further benefit the development of MXene‑based composites for high-performance electronic devices.