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Deposition of droplet-free films by vacuum arc evaporation-results and applications

A pulsed high current metal ion source that produces a metallic plasma flux was designed and successfully used for film deposition. The plasma flux consists of the fully ionized plasma beam produced by a pulsed high current vacuum arc transported through a curved magnetic duct. Deposition rates of m...

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Published in:	IEEE transactions on plasma science 1999-08, Vol.27 (4), p.1039-1044
Main Authors:	Witke, T., Siemroth, P.
Format:	Article
Language:	English
Subjects:	Adjustable Amorphous magnetic materials Beams (radiation) Carbon Deposition Diamond-like carbon Filters Flux High current Ion beams Ion sources Ions Macroparticles Magnetic films Magnetic flux Particle beams Physics Pits Plasma Plasma sources Plasma transport processes Vacuum arcs
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container_title	IEEE transactions on plasma science
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creator	Witke, T. Siemroth, P.
description	A pulsed high current metal ion source that produces a metallic plasma flux was designed and successfully used for film deposition. The plasma flux consists of the fully ionized plasma beam produced by a pulsed high current vacuum arc transported through a curved magnetic duct. Deposition rates of more than ten nm/s were achieved. The deposited layers are free of macroparticles, holes, and pits. Films of about 50 nm thickness have been deposited homogeneously (thickness variation below 5%) on a 4 in substrate after 300 pulses. Repetition rates are adjustable from more than 100 Hz down to a single pulse depending on the acceptable thermal input. Several applications are described in the paper: 1) deposition of hard, amorphous carbon films (diamond like carbon), 2) droplet-free TiN films for advanced applications, 3) transparent Al/sub 2/O/sub 3/ protective coatings, and 4) metallization for microelectronics.
doi_str_mv	10.1109/27.782278
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Several applications are described in the paper: 1) deposition of hard, amorphous carbon films (diamond like carbon), 2) droplet-free TiN films for advanced applications, 3) transparent Al/sub 2/O/sub 3/ protective coatings, and 4) metallization for microelectronics.</description><subject>Adjustable</subject><subject>Amorphous magnetic materials</subject><subject>Beams (radiation)</subject><subject>Carbon</subject><subject>Deposition</subject><subject>Diamond-like carbon</subject><subject>Filters</subject><subject>Flux</subject><subject>High current</subject><subject>Ion beams</subject><subject>Ion sources</subject><subject>Ions</subject><subject>Macroparticles</subject><subject>Magnetic films</subject><subject>Magnetic flux</subject><subject>Particle beams</subject><subject>Physics</subject><subject>Pits</subject><subject>Plasma</subject><subject>Plasma sources</subject><subject>Plasma transport processes</subject><subject>Vacuum arcs</subject><issn>0093-3813</issn><issn>1939-9375</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNqN0T1PwzAQBmALgUQpDKxMFgOIIcV27Dg3ovIpVWIA5shJzlKqNA52Uqn_nrSpGBhQp5PuHr3DvYRccjbjnMG90DOdCqHTIzLhEEMEsVbHZMIYxFGc8viUnIWwZIxLxcSEfDxi60LVVa6hztLSu7bGLrIekdqqXgWab-jaFH2_osYXFNemdd5sfeQx9HUXqGlKatq2rordPpyTE2vqgBf7OSVfz0-f89do8f7yNn9YRIVMZBdxm5bMWq4LyWVegkaRSguQpjKXyoKRpVaoY8NBC2ahZGBzXebW5kqhwXhKbsfc1rvvHkOXrapQYF2bBl0fMuAAQmkmBnnzrxQD5VIfANMEEnlI4rYEBWqA13_g0vW-Gf6ScVA8gXiXdjeiwrsQPNqs9dXK-E3GWbbtNRM6G3sd7NVoK0T8dfvjD5tJnRs</recordid><startdate>19990801</startdate><enddate>19990801</enddate><creator>Witke, T.</creator><creator>Siemroth, P.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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issn	0093-3813 1939-9375
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source	IEEE Electronic Library (IEL) Journals
subjects	Adjustable Amorphous magnetic materials Beams (radiation) Carbon Deposition Diamond-like carbon Filters Flux High current Ion beams Ion sources Ions Macroparticles Magnetic films Magnetic flux Particle beams Physics Pits Plasma Plasma sources Plasma transport processes Vacuum arcs
title	Deposition of droplet-free films by vacuum arc evaporation-results and applications
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