Kinetics of copper electrodeposition onto Polypyrrole films previously synthesised onto iron in oxalic aqueous solution. Application to electrocatalysis

Copper electrodeposition onto previously synthesised Polypyrrole (PPy) onto iron in oxalic medium has been investigated using polarization and electrochemical impedance spectroscopy. This investigation was done at potential range where hydrogen evolution does not occur. The kinetics of this reaction...

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Bibliographic Details
Published in:Thin solid films 2006-12, Vol.515 (4), p.1992-1997
Main Authors: Aitout, R., Makhloufi, L., Saidani, B.
Format: Article
Language:English
Subjects:
Copper deposition
Cross-disciplinary physics: materials science
rheology
Electrocatalysis
Electrochemical impedance spectroscopy
Electrodeposition, electroplating
Exact sciences and technology
Iron
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
Polypyrrole
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Summary:Copper electrodeposition onto previously synthesised Polypyrrole (PPy) onto iron in oxalic medium has been investigated using polarization and electrochemical impedance spectroscopy. This investigation was done at potential range where hydrogen evolution does not occur. The kinetics of this reaction was found to be under diffusion control and the diffusion coefficient of reactive species was found to be 6.4±0.1×10−6 cm2 s−1. The electrochemical impedance spectroscopy was used to estimate the roughness variation of the electrode surface during copper electrodeposition. Scanning Electron Microscopy observation of Fe/PPy/Cu films provide strong evidence of the close relationship between deposit morphology and electrocatalytic activity.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2006.03.011