2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high‐power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat...

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Bibliographic Details
Published in:Advanced materials (Weinheim) 2024-09, Vol.36 (37), p.e2311335-n/a
Main Authors: Dai, Wen, Wang, Yandong, Li, Maohua, Chen, Lu, Yan, Qingwei, Yu, Jinhong, Jiang, Nan, Lin, Cheng‐Te
Format: Article
Language:English
Subjects:
2D materials
Boron nitride
Communications equipment
development history
Graphene
Heat
Heat sinks
Heat transfer
Structural design
Thermal conductivity
thermal interface materials
Two dimensional analysis
Two dimensional materials
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