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Fabrication of flower-like CoFe/C composites derived from ferrocene-based metal-organic frameworks: an in situ growth strategy toward high-efficiency electromagnetic wave absorption

Magnetic/dielectric composites can achieve high-efficiency electromagnetic wave (EMW) absorption performance by integrating multiple mechanisms such as dielectric loss and magnetic loss. The bimetallic metal-organic frameworks (MOFs) assembled from ferrocene (Fc) derivative-based bridging ligands ar...

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Bibliographic Details
Published in:Nanoscale 2024-10, Vol.16 (40), p.18952-18961
Main Authors: Wang, Xueling, Zhang, Xuan, Lu, Jiaqi, Liu, Zhiliang
Format: Article
Language:English
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Summary:Magnetic/dielectric composites can achieve high-efficiency electromagnetic wave (EMW) absorption performance by integrating multiple mechanisms such as dielectric loss and magnetic loss. The bimetallic metal-organic frameworks (MOFs) assembled from ferrocene (Fc) derivative-based bridging ligands are considered ideal precursors for the preparation of magnetic/dielectric composites due to tailored alloy components with magnetic losses. Herein, a novel CoFe/C composite with nanoflower structures is successfully obtained an growth strategy to decompose an Fc-based bimetallic MOF assembled from 1,1'-ferrocene dicarboxylic acid as bridging ligands and Co ions. Notably, the nanoflower structures of the obtained composites provide an effective path for the scattering and reflection of the EMW, thereby improving the impedance matching by combining dielectric and magnetic loss. The CoFe/C composite exhibits excellent EMW absorption performance and has a minimum reflection loss of -61.6 dB at 3.7 mm and an effective absorption bandwidth of 6.24 GHz at a corresponding thickness of 2.2 mm. Moreover, the obtained composite exhibits lightweight characteristics and a low radar cross-section. This work presents a novel method through Fc-based bimetallic MOF derivatives to design and develop novel magnetic/dielectric composites with efficient EMW absorption properties for comprehensive applications.
ISSN:2040-3364
2040-3372
2040-3372
DOI:10.1039/d4nr02661f