Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

• Published in: Advanced functional materials 2008-03, Vol.18 (5), p.679-686
• Main Authors: Jeong, Sunho, Woo, Kyoohee, Kim, Dongjo, Lim, Soonkwon, Kim, Jang Sub, Shin, Hyunjung, Xia, Younan, Moon, Jooho
• Format: Article
• Language: English
• Subjects: Conductive ink; Cu nanoparticles; Ink-jet printing; Plastic substrate; Surface oxide layer
• ISSN: 1616-301X; 1616-3028
• DOI: 10.1002/adfm.200700902

With the aim of preparing a high performance conductive ink, we sought to control the surface chemistry of Cu nanoparticles so as to minimize surface oxidation. Specifically, the surface oxide layer on Cu nanoparticles synthesized in ambient atmosphere was minimized by adjusting the molecular weight of poly(N‐vinylpyrrolidone) capping molecules, as confirmed by high resolution transmission electron microscopy and X‐ray photoelectron spectroscopy analyses. In addition, we demonstrate that by minimizing the thickness of the surface oxide layer, Cu granular films with good conductivity could be obtained by sintering nanoparticle assembles. Finally, we fabricated highly conductive Cu patterns on a plastic substrate by ink‐jet printing. Cu nanoparticle‐based conductive ink‐jet printable inks: To prepare a high performance conductive ink, the surface oxide layer on Cu nanoparticles synthesized in ambient atmosphere was minimized by adjusting the molecular weight of poly(N‐vinylpyrrolidone) capping molecules. By minimizing the thickness of the layer, Cu granular films on a plastic substrate with good conductivity could be obtained by sintering nanoparticle assembles.