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Plasma/thermal-driven the rapid wettability transition on a copper surface
▶ A superhydrophobic surface was fabricated on the copper substrate by a simple solution–immersion process followed by stearic acid modification. ▶ Reversible wettability transition was realized by the alternation of plasma treatment and annealing process. ▶ It just took 21min to fulfill the whole w...
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Published in: | Applied surface science 2011-02, Vol.257 (8), p.3753-3757 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | ▶ A superhydrophobic surface was fabricated on the copper substrate by a simple solution–immersion process followed by stearic acid modification. ▶ Reversible wettability transition was realized by the alternation of plasma treatment and annealing process. ▶ It just took 21min to fulfill the whole wetting transition.
A simple and time-saving method to realize the reversible wettability transition is reported. Through a solution–immersion process followed by stearic acid modification, a superhydrophobic surface was prepared on the copper surface. After being treated by air-plasma exposure, the surface wettability was converted into superhydrophilicity. XPS analysis demonstrated that the incorporation of oxygen species by air-plasma activation accounted for the highly hydrophilic character of the surface. Upon annealing the plasma-treated surface in air, the non-oxidized alkyl chains were transferred to the surface for recovery the superhydrophobicity. It was found that the recovery was fast upon annealing at a relative high temperature. By the alternation of air-plasma treatment and annealing process, the rapid reversible wettability transition between superhydrophobic and superhydrophilic state was realized. The shortest processing time for a whole reversible wettability transition was 21min. |
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ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2010.11.132 |