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Plasma/thermal-driven the rapid wettability transition on a copper surface

▶ A superhydrophobic surface was fabricated on the copper substrate by a simple solution–immersion process followed by stearic acid modification. ▶ Reversible wettability transition was realized by the alternation of plasma treatment and annealing process. ▶ It just took 21min to fulfill the whole w...

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Bibliographic Details
Published in:Applied surface science 2011-02, Vol.257 (8), p.3753-3757
Main Authors: Zhu, Xiaotao, Zhang, Zhaozhu, Men, Xuehu, Yang, Jin, Xu, Xianghui, Zhou, Xiaoyan
Format: Article
Language:English
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Summary:▶ A superhydrophobic surface was fabricated on the copper substrate by a simple solution–immersion process followed by stearic acid modification. ▶ Reversible wettability transition was realized by the alternation of plasma treatment and annealing process. ▶ It just took 21min to fulfill the whole wetting transition. A simple and time-saving method to realize the reversible wettability transition is reported. Through a solution–immersion process followed by stearic acid modification, a superhydrophobic surface was prepared on the copper surface. After being treated by air-plasma exposure, the surface wettability was converted into superhydrophilicity. XPS analysis demonstrated that the incorporation of oxygen species by air-plasma activation accounted for the highly hydrophilic character of the surface. Upon annealing the plasma-treated surface in air, the non-oxidized alkyl chains were transferred to the surface for recovery the superhydrophobicity. It was found that the recovery was fast upon annealing at a relative high temperature. By the alternation of air-plasma treatment and annealing process, the rapid reversible wettability transition between superhydrophobic and superhydrophilic state was realized. The shortest processing time for a whole reversible wettability transition was 21min.
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2010.11.132