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Comparison of GRCop-84 to Other Cu Alloys with High Thermal Conductivities
The mechanical properties of six highly conductive copper alloys, GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z were compared. Tests were done on as-received hard drawn material, and after a heat treatment designed to simulate a brazing operation at 935 °C. In the as-received...
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Published in: | Journal of materials engineering and performance 2008-08, Vol.17 (4), p.594-606 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The mechanical properties of six highly conductive copper alloys, GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z were compared. Tests were done on as-received hard drawn material, and after a heat treatment designed to simulate a brazing operation at 935 °C. In the as-received condition AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, and Cu-0.9Cr had excellent strengths at temperatures below 500 °C. However, the brazing heat treatment substantially decreased the mechanical properties of AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the heat treatment. Thus there appear to be advantages to GRCop-84 over AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z if use or processing temperatures greater than 500 °C are expected. Ductility was the lowest in GlidCop Al-15 and Cu-0.9Cr; reduction in area was particularly low in GlidCop Al-15 above 500 °C, and as-received Cu-0.9Cr was brittle between 500 and 650 °C. Tensile creep tests were done at 500 and 650 °C; the creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z. In the brazed condition, GRCop-84 was superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z) and ductility (compared to GlidCop Al-15). |
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ISSN: | 1059-9495 1544-1024 |
DOI: | 10.1007/s11665-007-9175-3 |