Anti-reflective coatings : A story of interfaces

The semiconductor manufacturing industry has moved into an era where lithographic patterning can no longer be performed by simply coating the wafer with a layer of photoresist, exposing and developing that photoresist and then etching the desired feature onto the wafer's surface. Instead, it is...

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Bibliographic Details
Published in:Semiconductor international 1999-03, Vol.22 (3), p.55-60
Main Author: SINGER, P
Format: Magazinearticle
Language:English
Subjects:
Applications
Applied sciences
Electronics
Exact sciences and technology
General (including economical and industrial fields)
Interfaces
Light
Microelectronic fabrication (materials and surfaces technology)
Optical properties
Optics
Protective coatings
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductors
Silicon
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Summary:The semiconductor manufacturing industry has moved into an era where lithographic patterning can no longer be performed by simply coating the wafer with a layer of photoresist, exposing and developing that photoresist and then etching the desired feature onto the wafer's surface. Instead, it is necessary to deposit at least one extra layer before the photoresist is spun on. This extra layer is designed to prevent reflection of light that is transmitted through the photoresist, reflected off the substrate and back into the photoresist, where it can interfere with incoming light and cause the resist to be unevenly exposed. Called bottom anti-reflective coatings, these layers are now used extensively in applications such as gate definition and for opening contacts, where it is important to keep tight control over critical dimensions. As the industry transitions to light with shorter wavelengths, the challenges of minimizing reflections increase.
ISSN:0163-3767