Computational Optimization of Sandwich Silicone Rubber Composite for Improved Thermal Conductivity and Electrical Insulation

The efficient dissipation of heat has emerged as a crucial concern for modern electronic devices, given the continuous increase in their power density and consumption. Thus, the utilization of thermally conductive but electrically insulating silicone rubber composites as a thermal interface material...

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Bibliographic Details
Published in:Polymers 2024-02, Vol.16 (5), p.616
Main Author: Alghamdi, Abdulrahman A
Format: Article
Language:English
Subjects:
Analysis
Boron nitride
Carbon
Composite materials
Conductivity
Electric properties
Electrical conductivity
Electrical insulation
Electrical resistivity
Filler materials
Fillers
Finite element method
Graphene
Graphite
Heat conductivity
Heat transfer
High density polyethylenes
Percolation
Polymers
Power consumption
Rubber
Silicone rubber
Silicones
Thermal conductivity
Thermal properties
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Summary:The efficient dissipation of heat has emerged as a crucial concern for modern electronic devices, given the continuous increase in their power density and consumption. Thus, the utilization of thermally conductive but electrically insulating silicone rubber composites as a thermal interface material has garnered significant interest. In this study, the effects of the filler volume fraction, filler orientation, layer volume fractions, layer configuration, and a number of layers on the thermal conductivity and electrical resistivity of silicone rubber composites were examined using a multiscale finite element modeling strategy. The results demonstrated that modification of the filler orientation can change the thermal conductivity by 28 and 21 times in the in-plane and through-thickness directions, respectively. The in-plane thermal conductivities of silicone rubber/boron nitride and silicone rubber/expanded graphite layers exhibit a percolation phenomenon at filler volume fractions of 35% and 30%, respectively. The electrical resistivity of the composite increases exponentially with a decrease in the number of layers.
ISSN:2073-4360
2073-4360
DOI:10.3390/polym16050616