Loading…
Fast inverse design of microwave and infrared Bi-stealth metamaterials based on equivalent circuit model
This work proposed a fast inverse design method for microwave and infrared (IR) bi-stealth metamaterials based on the equivalent circuit model (ECM). Using this method, we designed a microwave and IR bi-stealth metamaterial by deploying a multilayered structure of the indium tin oxide (ITO) film bas...
Saved in:
Published in: | Journal of applied physics 2024-09, Vol.136 (11) |
---|---|
Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | This work proposed a fast inverse design method for microwave and infrared (IR) bi-stealth metamaterials based on the equivalent circuit model (ECM). Using this method, we designed a microwave and IR bi-stealth metamaterial by deploying a multilayered structure of the indium tin oxide (ITO) film based metasurface. First, the IR emissivity of the ITO film was calculated in the framework of the ECM. Then, an ITO metasurface was proposed to implement low IR emission and high microwave transmission simultaneously. Based on the ECM of the square patch, the ECM of the whole metamaterial was established at the microwave band. An inverse design program was built by incorporating the ECM with genetic algorithm (GA). Structure parameters of the metamaterial were optimized by GA to achieve the broadest microwave stealth bandwidth for the given thickness. Finally, the sample of the optimized bi-stealth metamaterial was prepared and tested. The calculated, simulated, and measured results are in good agreement, showing that such a metamaterial has an IR emissivity of 0.18 in the band from 3 to 14 μm and an efficient microwave stealth band from 4.8 to 17 GHz with a thickness of 4.9 mm. The proposed method will benefit the design and application of microwave and IR bi-stealth metamaterials. |
---|---|
ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/5.0222949 |