Investigating Leucaenna Leucocephala: A mechanical testing analysis for microwave substrate applications

This research examines the effect of Polypropylene (P.P.) and Leucaenna Leucocephala (L. Leucocephala) filler compositions on the mechanical properties of biocomposite substrates, targeting microwave antenna applications. The study assessed substrate integrity from different filler concentrations at...

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Bibliographic Details
Main Authors: Aziz, A., Ibrahim, Z., Ramli, N., Narendran, R.
Format: Conference Proceeding
Language:English
Subjects:
Biomedical materials
Composite materials
Deformation resistance
Fillers
Mechanical properties
Mechanical tests
Microwave antennas
Modulus of elasticity
Modulus of rupture
Polypropylene
Strain
Substrates
Tensile strength
Tensile tests
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Summary:This research examines the effect of Polypropylene (P.P.) and Leucaenna Leucocephala (L. Leucocephala) filler compositions on the mechanical properties of biocomposite substrates, targeting microwave antenna applications. The study assessed substrate integrity from different filler concentrations at the Fibre and Biocomposite Centre (FIDEC), Banting, Selangor, Malaysia. By using a compressed blend of polypropylene and wood filler, the substrates were subjected to three-point flexural bending and tensile tests as a scope for mechanical testing in compliance with ASTM D638 and D790 standards. The findings underscored a direct correlation between wood filler quantity and tensile strength; substrates with reduced wood filler exhibited superior elongation and strain metrics. A comparison between PP100 and PB6040 substrates revealed a 21 percent difference in maximum load. Despite the variation in the wood filler, all substrates remained within the antenna’s mechanical threshold. Flexural data reinforced these outcomes, with the PP100 substrate outperforming load capacity and the Modulus of Rupture (MOR). Conversely, the Modulus of Elasticity (MOE) data presented an inverse pattern, indicating substrates like PB6040 exhibited higher deformation resistance. The study concludes that environmentally sustainable substrate alternatives can uphold robust mechanical properties, positioning them as viable options for future telecommunications endeavours.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0230022