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Low-temperature Ar/N 2 remote plasma nitridation of SiO 2 thin films
Low-temperature nitridation of SiO 2 thin films by Ar/N 2 remote plasma processing was investigated using on-line Auger electron spectroscopy, angle-resolved x-ray photoelectron spectroscopy (ARXPS), and optical emission spectroscopy (OES). Nitridation experiments were performed at 300 ° C using 30...
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Published in: | Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2002-11, Vol.20 (6), p.1989-1996 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Online Access: | Get full text |
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Summary: | Low-temperature nitridation of
SiO
2
thin films by
Ar/N
2
remote plasma processing was investigated using on-line Auger electron spectroscopy, angle-resolved x-ray photoelectron spectroscopy (ARXPS), and optical emission spectroscopy (OES). Nitridation experiments were performed at
300 °
C
using 30 W
Ar/N
2
remote plasmas at 0.1 and 0.3 Torr.
Ar/N
2
remote plasma exposure of 5 nm
SiO
2
films for 30 min results in nitrogen incorporation throughout the films, independent of process pressure and plasma reactor configuration (i.e., upstream versus downstream
N
2
injection). ARXPS indicates a
N–Si
3
local bonding configuration with second nearest neighbor oxygen atoms.
Ar/N
2
remote plasma exposure at 0.1 Torr results in higher nitrogen concentrations (8–10 at. %). Reactor configuration has a negligible effect at 0.1 Torr; conversely, downstream
N
2
injection results in higher nitrogen concentrations (5–6 at. %) than upstream injection (3–4 at. %) at 0.3 Torr. OES indicates that the
Ar/N
2
remote plasmas contain
N
2
triplet excited states and ground-state N atoms. The Ar emission intensities and the saturation N concentrations in the resultant films follow similar trends with processing pressure and reactor configuration; the
N
2
first positive emission intensities run counter to these trends. We infer that low-temperature
SiO
2
nitridation by
Ar/N
2
remote plasmas is a two-step process: O removal by
Ar
+
ion bombardment and N insertion by plasma-generated active N species. Moreover, the first step appears to be rate limiting under the conditions employed in this study. Annealing the oxynitride films in
N
2
at
900 °
C
decreases the N concentration and results in a more uniform nitrogen distribution. |
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ISSN: | 0734-2101 1520-8559 |
DOI: | 10.1116/1.1513635 |