Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang. technology and applications in surface mount, hybrid circuits, and component assembly /

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Bibliographic Details
Main Author: Hwang, Jennie S.
Format: Book
Language:English
Published: New York : Van Nostrand Reinhold, c1989
Subjects:
Printed circuits > Design and construction
Solder pastes
Surface mount technology
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Pilkington Library

Availability details from Pilkington Library
Shelfmark: 621.38174/HWA
Copy number Shelving location Availability
Copy [0400203480] Unknown On Shelf

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