New technology in electronic packaging : proceedings of ASM International's 3rd Electronic Materials & Processing Congress, San Francisco, California, USA, 20-23 August 1990 / edited by B.R. Livesay and M.D. Nagarkar.

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Bibliographic Details
Corporate Authors: Electronic Materials and Processing Congress San Francisco, Calif., ASM International. Electronic Materials and Processing Division
Other Authors: Livesay, B. R., Nagarkar, M. D.
Format: Book
Language:English
Published: Materials Park, Ohio : ASM International, 1990
Subjects:
Electronic packaging > Congresses
Microelectronic packaging > Congresses
Microelectronics > Corrosion > Congresses
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