Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett..
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| Corporate Authors: | , , |
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| Other Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
New York :
The Society,
c1992
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| Series: | EEP ;
v.2. PED ; v.60. |
| Subjects: | |
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