Thermal stress and strain in microelectronics packaging / edited by John H. Lau..
Saved in:
| Other Authors: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York :
Van Nostrand Reinhold,
c1993
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|