Library Catalogue Plus

APA (7th ed.) Citation

Lau, J. H. (1993). Thermal stress and strain in microelectronics packaging / edited by John H. Lau. Van Nostrand Reinhold.

Chicago Style (17th ed.) Citation

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging / Edited by John H. Lau. New York: Van Nostrand Reinhold, 1993.

MLA (9th ed.) Citation

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging / Edited by John H. Lau. Van Nostrand Reinhold, 1993.