Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht.
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York ; Chichester :
Wiley,
1994
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|