Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht.
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| Corporate Authors: | , |
|---|---|
| Other Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
New York, NY :
American Society of Mechanical Engineers,
1993
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| Series: | EEP (Series) ;
v.6 |
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