Pecht. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Meeting, Nguyen, L. T., & Pecht, M. (1993). Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Luu T. Nguyen, Michael G. Pecht: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. American Society of Mechanical Engineers.
Chicago Style (17th ed.) CitationPecht. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Winter Meeting, Luu T. Nguyen, and Michael Pecht. Electronic Packaging Reliability : Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / Sponsored by the Electrical and Electronic Packaging Division, ASME ; Edited by Luu T. Nguyen, Michael G. Pecht: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York, NY: American Society of Mechanical Engineers, 1993.
MLA (9th ed.) CitationPecht. Electrical and Electronic Packaging Division, et al. Electronic Packaging Reliability : Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 / Sponsored by the Electrical and Electronic Packaging Division, ASME ; Edited by Luu T. Nguyen, Michael G. Pecht: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. American Society of Mechanical Engineers, 1993.