Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.
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| Main Author: | |
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| Corporate Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
McGraw-Hill,
1997
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| Edition: | 2nd ed.. |
| Series: | Electronic packaging and interconnection series
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| Subjects: | |
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