APA (7th ed.) Citation

Harman, G. G. (1997). Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman: Materials, processes, reliability, and yield (2nd ed.). McGraw-Hill.

Chicago Style (17th ed.) Citation

Harman, George G. Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield / George G. Harman: Materials, Processes, Reliability, and Yield. 2nd ed. New York ; London: McGraw-Hill, 1997.

MLA (9th ed.) Citation

Harman, George G. Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield / George G. Harman: Materials, Processes, Reliability, and Yield. 2nd ed. McGraw-Hill, 1997.

Warning: These citations may not always be 100% accurate.