Loading…

Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.]. design, materials, process, and reliability /

Saved in:
Bibliographic Details
Other Authors: Lau, John H.
Format: Book
Language:English
Published: New York ; London : McGraw-Hill, 1998.
Series:Electronic packaging and interconnection series
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!

Pilkington Library

Availability details from Pilkington Library
Shelfmark: 621.381046/ELE
Copy number Shelving location Availability
Copy [0401584135] Unknown On Shelf
Copy [040248231X] Unknown On Shelf