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Electronic packaging : design, materials, process, and reliability / John H. Lau ... [et al.]. design, materials, process, and reliability /
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| Other Authors: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
McGraw-Hill,
1998.
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| Series: | Electronic packaging and interconnection series
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| Subjects: | |
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| Physical Description: | 450p. |
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| ISBN: | 0070371350 |