Loading…
Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee. design, materials, processes, reliability, and applications /
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
London :
McGraw-Hill,
1999
|
| Series: | Electronic packaging and interconnection
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Pilkington Library
|
Shelfmark:
621.381046/LAU |
|
|
Copy number
Shelving location
Availability
| |
|
Copy [0402039009]
Unknown
On Shelf
|
|