Library Catalogue Plus

APA (7th ed.) Citation

Lau, J. H., & Lee, S. R. (1999). Chip scale package (CSP) : design, materials, processes, reliability, and applications / John Lau, Shi-Wei Ricky Lee: Design, materials, processes, reliability, and applications. McGraw-Hill.

Chicago Style (17th ed.) Citation

Lau, John H., and Shi-Wei Ricky Lee. Chip Scale Package (CSP) : Design, Materials, Processes, Reliability, and Applications / John Lau, Shi-Wei Ricky Lee: Design, Materials, Processes, Reliability, and Applications. London: McGraw-Hill, 1999.

MLA (9th ed.) Citation

Lau, John H., and Shi-Wei Ricky Lee. Chip Scale Package (CSP) : Design, Materials, Processes, Reliability, and Applications / John Lau, Shi-Wei Ricky Lee: Design, Materials, Processes, Reliability, and Applications. McGraw-Hill, 1999.