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Reflow soldering processes and...
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Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee.
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Bibliographic Details
Main Author:
Lee, Ning-Cheng
Format:
Book
Language:
English
Published:
Oxford :
Newnes,
2000.
Subjects:
Printed circuits
>
Design and construction
Electronics packaging
Solder and soldering
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