Skip to content
VuFind
Log in
Library Catalogue Plus
Library
Subject guides
Databases
Referencing
Catalogue
Articles Plus
All Fields
Title
Author
Subject
Shelfmark
ISBN/ISSN
Tag
Find
Advanced Search
Advanced wirebond interconnect...
Cite this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Export to BibTeX
Export to RIS
Save to List
Permanent link
Loading…
Advanced wirebond interconnection technology / by Shankara K. Prasad.
Saved in:
Bibliographic Details
Main Author:
Prasad, Shankara K.
Format:
Book
Language:
English
Published:
New York, N.Y. :
Springer,
2004.
Subjects:
Wire bonding (Electronic packaging)
>
Production control.
Electronic packaging
>
Reliability.
Tags:
Add Tag
No Tags, Be the first to tag this record!
Availability
Description
Similar Items
Staff View
Similar Items
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.
by: Harman, George G.
Published: (1997)
Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... (et al.)..
Published: (1994)
Copper interconnect technology / Christoph Steinbrüche, Barry Chin.
by: Steinbrüchel, Christoph
Published: (2001)
Reliability of electronic packages and semiconductor devices.
by: Di Giacomo, Giulio
Published: (1997)
Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Published: (1990)
