Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee.
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| Main Author: | |
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| Format: | eBook |
| Language: | English |
| Published: |
Oxford :
Newnes,
2002.
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| Subjects: | |
| Online Access: | https://ebookcentral.proquest.com/lib/lboro/detail.action?docID=294668 |
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