APA (7th ed.) Citation

Lee, N. (2002). Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee: SMT, BGA, CSP and flip chip technologies. Newnes.

Chicago Style (17th ed.) Citation

Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies / Ning-Cheng Lee: SMT, BGA, CSP and Flip Chip Technologies. Oxford: Newnes, 2002.

MLA (9th ed.) Citation

Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies / Ning-Cheng Lee: SMT, BGA, CSP and Flip Chip Technologies. Newnes, 2002.

Warning: These citations may not always be 100% accurate.