6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.].
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| Corporate Authors: | , , |
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| Format: | eBook |
| Language: | English |
| Published: |
[Piscataway, N.J.] :
IEEE,
c2006.
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| Subjects: | |
| Online Access: | http://ieeexplore.ieee.org/servlet/opac?punumber=10464 |
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