International Conference on Electronic Packaging Technology Shenzhen, China, Zhongguo dian zi xue hui, & Components, Packaging & Manufacturing Technology Society. (2006). 6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with, IEEE-CPMT (USA) ... [et al.]: La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005. IEEE.
Chicago Style (17th ed.) CitationInternational Conference on Electronic Packaging Technology Shenzhen, China, Zhongguo dian zi xue hui, and Packaging & Manufacturing Technology Society Components. 6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / Sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; Technical Co-sponsorship with, IEEE-CPMT (USA) ... [et Al.]: La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005. [Piscataway, N.J.]: IEEE, 2006.
MLA (9th ed.) CitationInternational Conference on Electronic Packaging Technology Shenzhen, China, et al. 6th International Conference on Electronic Packaging Technology La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005 / Sponsored by Chinese Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS) ; Technical Co-sponsorship with, IEEE-CPMT (USA) ... [et Al.]: La Waterfron Hotel, Dameisha, Shenzhen, China, August 30-September 2, 2005. IEEE, 2006.