Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) June 27th-June 30 2006 : Shanghai University, Shanghai, China / organized by IEEE ... [et al.].

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Bibliographic Details
Corporate Authors: IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis Shanghai, China, Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society, IEEE Xplore (Online service)
Format: eBook
Language:English
Published: Piscataway, NJ : IEEE, 2006.
Subjects:
Integrated circuits > Design and construction > Congresses.
Electronic packaging > Congresses.
Microelectromechanical systems > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=11190
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