Library Catalogue Plus

APA (7th ed.) Citation

IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis Shanghai, China, Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society, & IEEE Xplore (Online service). (2006). Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) June 27th-June 30 2006 : Shanghai University, Shanghai, China / organized by IEEE ... [et al.]: June 27th-June 30 2006 : Shanghai University, Shanghai, China. IEEE.

Chicago Style (17th ed.) Citation

IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis Shanghai, China, Institute of Electrical and Electronics Engineers, Packaging & Manufacturing Technology Society Components, and IEEE Xplore (Online service). Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) June 27th-June 30 2006 : Shanghai University, Shanghai, China / Organized by IEEE ... [et Al.]: June 27th-June 30 2006 : Shanghai University, Shanghai, China. Piscataway, NJ: IEEE, 2006.

MLA (9th ed.) Citation

IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis Shanghai, China, et al. Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) June 27th-June 30 2006 : Shanghai University, Shanghai, China / Organized by IEEE ... [et Al.]: June 27th-June 30 2006 : Shanghai University, Shanghai, China. IEEE, 2006.