10th IEEE Workshop on Signal Propagation on Interconnects proceedings : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) and by IEEE Computer Society, Test Technology Technical Council (TTTC).

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Bibliographic Details
Corporate Authors: IEEE Workshop on Signal Propagation on Interconnects Berlin, Germany, Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation, IEEE Computer Society. Technical Council on Test Technology, IEEE Xplore (Online service)
Format: eBook
Language:English
Published: Piscataway, N.J. : IEEE, c2006.
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Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4069376
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