6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Polytronic 2007 : proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007 / IEEE, IEEE Components, Packaging and Manufacturing Technology Society.

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Bibliographic Details
Corporate Authors: International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Tokyo, Japan, Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society
Format: eBook
Language:English
Published: Piscataway, NJ : IEEE, 2007.
Subjects:
Microelectronic packaging > Materials > Congresses.
Polymers > Congresses.
Integrated circuits > Reliability > Congresses.
Photonics > Materials > Congresses.
Polymeric composites > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4339118
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