International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Tokyo, Japan, Institute of Electrical and Electronics Engineers, & Components, Packaging & Manufacturing Technology Society. (2007). 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Polytronic 2007 : proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007 / IEEE, IEEE Components, Packaging and Manufacturing Technology Society: Polytronic 2007 : proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007. IEEE.
Chicago Style (17th ed.) CitationInternational IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Tokyo, Japan, Institute of Electrical and Electronics Engineers, and Packaging & Manufacturing Technology Society Components. 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Polytronic 2007 : Proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007 / IEEE, IEEE Components, Packaging and Manufacturing Technology Society: Polytronic 2007 : Proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007. Piscataway, NJ: IEEE, 2007.
MLA (9th ed.) CitationInternational IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Tokyo, Japan, et al. 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics Polytronic 2007 : Proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007 / IEEE, IEEE Components, Packaging and Manufacturing Technology Society: Polytronic 2007 : Proceedings 2007 : Odaiba, Tokyo, Japan, January 15-18, 2007. IEEE, 2007.