ICEPT 2006 proceedings : 7th International Conference on Electronics Packaging Technology chairman, Keyun, Bi.

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Bibliographic Details
Corporate Authors: International Conference on Electronic Packaging Technology Shanghai, China, Institute of Electrical and Electronics Engineers, China Electronic Packaging Society, IEEE Xplore (Online service)
Other Authors: Bi, Keyun
Format: eBook
Language:English
Published: Piscataway, NJ : IEEE Press, 2006.
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Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4198846
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