Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on date, 11-14 Dec. 2006.
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| Format: | eBook |
| Language: | English |
| Published: |
[Piscataway, N.J.] :
IEEE Xplore,
c2006.
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| Subjects: | |
| Online Access: | http://ieeexplore.ieee.org/servlet/opac?punumber=4430557 |
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