APA (7th ed.) Citation

International Symposium on Electronic Materials and Packaging Hong Kong, China. (2006). Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on date, 11-14 Dec. 2006: Date, 11-14 Dec. 2006. IEEE Xplore.

Chicago Style (17th ed.) Citation

International Symposium on Electronic Materials and Packaging Hong Kong, China. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on Date, 11-14 Dec. 2006: Date, 11-14 Dec. 2006. [Piscataway, N.J.]: IEEE Xplore, 2006.

MLA (9th ed.) Citation

International Symposium on Electronic Materials and Packaging Hong Kong, China. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on Date, 11-14 Dec. 2006: Date, 11-14 Dec. 2006. IEEE Xplore, 2006.

Warning: These citations may not always be 100% accurate.