Proceedings, 11th IEEE Workshop on Signal Propagation on Interconnects May 13-16, 2007, Hotel Portofino Kulm, Camogli (Genova), Italy / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS), and by IEEE Computer Society, Test Technology Technical Council (TTTC).

Saved in:
Bibliographic Details
Corporate Authors: IEEE Workshop on Signal Propagation on Interconnects Camogli, Italy, Components, Packaging & Manufacturing Technology Society. Technical Committee on Electrical Design, Modeling and Simulation, IEEE Computer Society. Technical Council on Test Technology
Format: eBook
Language:English
Published: Piscataway, N.J. : IEEE, c2007.
Subjects:
Printed circuits > Congresses.
Interconnects (Integrated circuit technology) > Congresses.
Signal theory (Telecommunication) > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4475927
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items